We deliver end-to-end analog and mixed-signal layout services, partnering with semiconductor companies to take designs from block-level implementation through full-chip integration. Our layouts are foundry-clean, signoff-complete, and GDSII-ready, enabling confident first-pass silicon success across advanced, mainstream, and mature technology nodes.
Our teams support complex analog IPs as well as full-chip ownership, working as an extension of your design organization. We combine deep analog layout expertise with disciplined physical verification to reduce integration risk, accelerate schedules, and ensure predictable tape-outs.
We work across advanced FinFET and GAAFET nodes (7 nm, 5 nm, 3 nm, and 2 nm class) as well as mainstream and mature CMOS processes, including 16/14 nm, 22 nm FDSOI, 28 nm, 40 nm, and nodes extending to 55/65 nm and beyond for power and cost-sensitive applications. Our experience spans leading foundries including TSMC, GlobalFoundries, and Intel.
We specialize in high-performance and precision analog blocks such as ADCs and DACs, PLLs, CDRs, and clocking systems, LDOs and DC-DC converters, bandgaps and references, ESD and reliability structures, and RF/analog front-end circuits. Our portfolio also includes high-speed PHYs for DDR, SerDes, Ethernet, and USB/Type-C, along with memory-adjacent and sensor-interface analog.
From early layout strategy and floorplanning to precision placement, routing, and full-chip integration, we apply proven techniques for matching, symmetry, noise isolation, EM/IR robustness, and thermal reliability. We own full physical verification and signoff, including DRC, LVS, PEX, EM/IR, antenna, ESD, and DFM, and interface directly with foundries to ensure smooth tape-outs.
A trusted Analog layout partner, aligned to your performance, quality, and schedule goals.
